Chips and Material Science

In semiconductor space, material science research plays a vital role. Miniaturization has led to a situation that any further performance and capabilities improvement of chips comes from the experience of material science experts who run advanced machines and conduct experiments.

Memory enhancement in chips requires a knowledge of material science. The mechanical stress is witnessed in the micro-structures of chips. It may threaten the structural integrity of the chip. The stress properties are leveraged to enhance the performance of the devices. The physical properties of the materials are best utilised for optimum performance.

In the chip industry, they encounter electro static discharge — ESD caused by a static charge from human beings and the tools used in production. ESD permanently damages chips if there are no safe discharge mechanisms. It requires special semiconductor protection. The devices that protect are designed based on an understanding of material science, semiconductor processing and carrier transport physics. Material science experts collaborate with proceess development teams. They use CAD tools to simulate high-current transport mechanisms in semiconductor materials, and thus design small ESD protection devices.

In automobiles, CAN transeiver is backed up by ESD protection.

Some material science experts facilitate the work of semiconductor foundries. They specialise in the deposition and etching process. In deposition, a thin film of materials are deposited on a silicon wafer. In etching, film and materials are selectively removed from the materials deposited on the wafer.

Surface engineering is vital for coating performance and it extends the life of components. Materials engineers can develop techniques that can deposit highly dense and porosity-free coatings to form a defect-free surface.

Materials engineers having experience in production and digital technology will have more opportunity in the semiconductor industry.

print

Leave a Reply

Your email address will not be published. Required fields are marked *