There is miniaturization of devices these days, for which chips are assembled by encasing them in metal and resin. There are chip packagers such as Advanced Semiconductor Engineering ( ASE ) from Taiwan. Apple’s watch is a wearable device in which they have crammed chips related to communication, graphics and location — all these chips into the tiniest space. This is called System-in-Package. It is a way to bundle components into plug-n-play. This packaging is akin to solving a jig-saw puzzle. These tightly packed chips communicate easily, and make the devices quicker and energy-efficient. Fingerprint sensor in Apple’s iPhones use this concept. SiP cost is higher than conventional chip packaging. A costlier approach is System-on-Chip ( SoC ) in which a single chip performs multiple functions. It is technologically more complex. They may scale up SoC in future to reduce the cost, but at present SiPs are cheaper and easier.